News GE launches Rugged COM Express Module Rugged COM Express Module from GE Delivers High Performance in Harsh, Space-Constrained Environments
bCOM2-L1100 leverages GE ruggedisation expertise to put Intel® Core™2 Duo processor into new applications
| GE Intelligent
Platforms has announced the bCOM2-L1100 rugged COM Express board |
bCOM2-L1100 |
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Designed specifically to respond to the growing requirement to deploy powerful computing solutions in harsh, space constrained environments such as mining, oil and gas, manufacturing test/ measurement, unmanned vehicles, exploration, transportation and military aerospace, it features an Intel® Core™2 Duo processor operating at up to 2.26GHz and up to 4GBytes of soldered DDR3 SDRAM.
Soldered components substantially improve reliability. A range of processors is available, depending on the performance/ watt requirements of the application.
The bCOM2-1100 provides extensive protection to ensure reliable
operation in applications that are subject to shock, vibration and
extremes of temperature (-40 to +85ºC). All components are soldered to
ensure optimum reliability, while mechanical stand-offs provide a high
degree of insulation from external forces. Available in a standard
version for benign environments, the bCOM2-L1100 is optionally available
in extended temperature variants with conformal coating.
“Not
only does the bCOM2-L1100 provide a solution for customer who need the
kind of rugged reliability associated with VMEbus and PCI Express in the
small form factor of COM Express, but it is also unique in the way it
combines performance with rugged reliability,” said Juergen Eder,
Product Manager at GE Intelligent Platforms.“Most other rugged COM
Express modules feature the less powerful Intel Atom processor, and
those that offer similar processing power to that of the bCOM2-L1100 use
SODIMM memory, which is more difficult to cool and thus gives them an
inferior MTBF. The bCOM2-L1100 delivers outstanding performance / watt
from a small, lightweight platform and is ideal for deployment in the
most demanding environments.”
As with all COM Express boards, a
carrier board is required for the bCOM2-L1100. The CCAR-L1100 carrier
board is available for initial development and testing. GE Intelligent
Platforms is also able to provide advice to customers designing their
own rugged carrier. Despite its small size, the bCOM2-L1100 offers
a broad range of connectivity and I/O capabilities, including Gigabit
Ethernet, eight USB 2.0 ports, four Serial ATA (SATA) ports (RAID
configurable), one PATA port, eight GPIO ports (four in/ four out), one
LVDS port, two SVDO channels, VGA, High Definition Audio (HDA) and PCI
Express (configurable as one 4x PCI Express lane or four 1x PCI Express
lanes). Also provided is a x16 PCI Express port for high end graphics
and video applications.
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- Extended operating temperature: –40° to +85°C
- SDVO and LVDS channel support
- Optional conformal coating
- Support of S0, S3 and S5 states
- Support for Windows® XP, Vista®, Linux®, and VxWorks®
Learn more about:
- bCOM2-L1100 link
- CCAR-L1000 link
- ACAL’s COM Express Range link
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GE Intelligent Platforms: Single Board Computers bCOM2-L1100
Rugged COM Express Board
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Introduction
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Features
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The bCOM2-L1100 is a rugged, Type 2 COM Express module in basic form factor. It features a soldered Intel Core 2 Duo processor with varying levels of performance-per-watt improvements to provide an excellent choice for System Integrators with low-power, high performance embedded
applications requirements.
The bCOM2-L1100 offers up to 4 GB of soldered DDR3 SDRAM memory to satisfy an application’s needs. One Gigabit Ethernet port is routed to the COM Expressconnector, located on the baseboard. This port supports transmissions of 10 and 100 Mbit/s. An additional eight USB 2.0 ports are routed to the COM Express connector.
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- Compliance to PICMG™ COM Express R1.0 basic form factor, Type 2
- Processors
- Intel® Core™ 2 processor, soldered
- Up to 2.26 GHz, 1066 MHz FSB,6 MB L2, 25 W
- Up to 2 (4) GB DDR3 SDRAM; soldered,non-ECC
- Intel GS45/ ICHM SFF chipset
- I/O Features
- 1x VGA
- 2x SDVO channels (shared with PEG)
- 1x LVDS (dual channel support)
- 1x Gigabit Ethernet
- 8x USB 2.0
- Audio HDA
- 4x Serial ATA ports (RAID)
- 1x PATA
- 8x GPIO (4 in, 4 out)
- Expansion
- 1x PCIe Graphics (PEG) x16
- 4x PCIe lanes
- 4x lanes x1 or 1x lanes x4
- Extended operating temperature range from –40° to +85° C
- Temperature sensors for CPU, chipset and module
- Optional conformal coating
- Support of S0, S3 and S5 states
- Support for Windows® XP, Vista®, Linux®,and VxWorks®
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GE Intelligent Platforms: Single Board Computers CCAR-L1000
COM Express Carrier Board
| Introduction |
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Features |
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The CCAR-L1000 is a COM Express carrier for basic COM Express module, Type 2. It supports the COM Express modules of the bCOM2-L1000 series.
CCAR-L1000 offers a wide range of standard PC features along with expansion capability via plug-in cards. The board allows configuring RAID on Serial ATA drives and supports RAID 0 and RAID 1. The CCAR-L1000 is the ideal platform to evaluate, benchmark or to execute software development and tests for application software before the final base board is available. It helps to accelerate the project design process.
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- Eight expansion slots, including CompactFlash
- Multiple Front and Rear I/O Connectors
- Two 220-pin COM Express Standard Connectors
- ATX form factor
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ACAL’s Computer-on-Module Product Range
Computer-on-Modules (COMs) are highly integrated single-board computers that provide the core functionality of a system, allowing application-specific features to be designed onto a carrier board creating a semi-custom embedded PC solution.
Computer on Modules (COM) address the need for standardized small form factor computing platforms and are the perfect solution for long-term applications where technology and performance upgrades are a must.
COMs are without connectors for USB, LAN, VGA, etc. and must be attached to an I/O board to fullfil an application's I/O requirements. Upgrades are easily managed through an exchange of the existing Computer Module to one based on the latest technology, in effect extending the lifecycle of the application.
ACAL offers the industry’s broadest range of COM modules from leading technology vendors.
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